Laser Drilling
Hitachi CO2 Laser
Hitachi CO2 Laser is a high-speed and high-precision laser drilling system used for micro via processing in HDI PCB and build-up PCB production.
Specifications
- Manufacturer
- Hitachi
- Model
- CO2 Laser
- Working Area
- PCB Panel Support
- Spindle
- -
- Speed
- High-speed via hole drilling
- Power
- CO2 Laser
- Voltage
- Factory Spec
- Application
- HDI PCB, Build-up PCB, IC Package, Automotive PCB
Detailed Description
Overview
Hitachi CO2 Laser is a high-performance laser drilling system used for micro via hole processing in PCB manufacturing. It uses CO2 laser technology to process insulating layers of build-up PCB and HDI PCB with high accuracy, making it suitable for high-density circuit board production.
This equipment is widely used in production lines where micro via quality and productivity are important, such as smartphone PCB, server PCB, semiconductor package substrate, and automotive electronics PCB.
Key Features
- CO2 laser-based micro via processing
- Suitable for HDI PCB and build-up PCB production
- High-speed via hole drilling
- High-precision processing at the micrometer level
- Applicable to mass production lines
- Suitable for smartphone, server, package substrate, and automotive PCB manufacturing
Applications
This system can be used for smartphone PCB, server PCB, semiconductor package substrate, automotive electronics PCB, HDI PCB, and build-up PCB manufacturing processes.