Laser Drilling
Mitsubishi CO2 Laser
Mitsubishi CO2 Laser is a high-speed and high-precision laser drilling system used for micro via processing on PCB insulating materials such as FR-4, RCC, and ABF.
Specifications
- Manufacturer
- Mitsubishi
- Model
- CO2 Laser
- Working Area
- PCB Panel Support
- Spindle
- -
- Speed
- High-speed drilling
- Power
- CO2 Laser
- Voltage
- Factory Spec
- Application
- FR-4, RCC, ABF, HDI PCB, IC Package
Detailed Description
Overview
Mitsubishi CO2 Laser is a laser drilling system used for micro via processing in PCB manufacturing. It is designed to process various PCB insulating materials such as FR-4, RCC, and ABF with high accuracy using CO2 laser technology.
With high-speed drilling capability and excellent positioning accuracy, this equipment is suitable for HDI PCB, IC package substrate, and high-density circuit board production lines.
Key Features
- CO2 laser technology at 10.6μm wavelength
- Suitable for PCB micro via processing
- Capable of processing FR-4, RCC, ABF, and other insulating materials
- High-speed drilling performance
- High positioning accuracy
- Can be integrated with automatic loading and unloading systems
- Suitable for mass production lines
Applications
This equipment can be used for HDI PCB, build-up PCB, IC package substrate, ABF substrate, smartphone PCB, server PCB, and automotive electronics PCB manufacturing processes.