Surface Treatment
Surface Planer
Surface Planer is used before and after PCB lamination, copper plating, exposure, and solder mask processes to improve flatness, remove oxide layers, eliminate burrs, and stabilize surface quality.
Specifications
- Manufacturer
- Ishiihyouki
- Model
- Surface Planer
- Working Area
- PCB Panel Support
- Spindle
- High-speed Spindle
- Speed
- Surface Milling / Grinding
- Power
- Factory Spec
- Voltage
- Factory Spec
- Application
- Multilayer PCB, HDI PCB, IC Package Substrate, Flex PCB
Detailed Description
Overview
Surface Planer is a surface processing machine used in PCB manufacturing to cut or grind the board surface evenly and secure stable flatness.
It is commonly used before and after lamination, copper plating, exposure, and solder mask processes to improve the surface condition of PCB panels.
By removing oxide layers, contamination, and burrs while maintaining consistent thickness and flatness, the equipment helps improve the quality of subsequent manufacturing processes.
Key Features
- PCB surface flattening
- Oxide layer and contamination removal
- Burr removal and thickness variation reduction
- Available for milling, grinding, and brush processes
- High-speed spindle and cutting head configuration
- Conveyor transport system support
- Dust collection and cleaning system integration available
Applications
This equipment can be used for multilayer PCB, HDI PCB, IC package substrate, flex PCB, metal core PCB, and PCB manufacturing processes requiring stable surface flatness.